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Title: Negative Thermal Expansion HfV 2 O 7 Nanostructures for Alleviation of Thermal Stress in Nanocomposite Coatings
Award ID(s):
1809866
NSF-PAR ID:
10341619
Author(s) / Creator(s):
; ; ; ; ; ;
Date Published:
Journal Name:
ACS Applied Materials & Interfaces
Volume:
13
Issue:
37
ISSN:
1944-8244
Page Range / eLocation ID:
44723 to 44732
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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