Kwon, Beomjin, Foulkes, Thomas, Yang, Tianyu, Miljkovic, Nenad, and King, William P. Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles. IEEE Transactions on Components, Packaging and Manufacturing Technology 10.2 Web. doi:10.1109/TCPMT.2019.2936852.

Kwon, Beomjin, Foulkes, Thomas, Yang, Tianyu, Miljkovic, Nenad, & King, William P. Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 (2). https://doi.org/10.1109/TCPMT.2019.2936852

Kwon, Beomjin, Foulkes, Thomas, Yang, Tianyu, Miljkovic, Nenad, and King, William P. "Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles". IEEE Transactions on Components, Packaging and Manufacturing Technology 10 (2). Country unknown/Code not available: Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/TCPMT.2019.2936852. https://par.nsf.gov/biblio/10365816.

@article{osti_10365816,
place = {Country unknown/Code not available}, title = {Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles}, url = {https://par.nsf.gov/biblio/10365816}, DOI = {10.1109/TCPMT.2019.2936852}, abstractNote = {Not Available}, journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology}, volume = {10}, number = {2}, publisher = {Institute of Electrical and Electronics Engineers}, author = {Kwon, Beomjin and Foulkes, Thomas and Yang, Tianyu and Miljkovic, Nenad and King, William P.}, }