Yang, Jun, Wang, Wei, Lin, Guang, Li, Qing, Sun, Yeqing, and Sun, Yixuan. Infrared Thermal Imaging-Based Crack Detection Using Deep Learning. IEEE Access 7. Web. doi:10.1109/ACCESS.2019.2958264.

Yang, Jun, Wang, Wei, Lin, Guang, Li, Qing, Sun, Yeqing, & Sun, Yixuan. Infrared Thermal Imaging-Based Crack Detection Using Deep Learning. IEEE Access, 7 (). https://doi.org/10.1109/ACCESS.2019.2958264

Yang, Jun, Wang, Wei, Lin, Guang, Li, Qing, Sun, Yeqing, and Sun, Yixuan. "Infrared Thermal Imaging-Based Crack Detection Using Deep Learning". IEEE Access 7 (). Country unknown/Code not available: Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ACCESS.2019.2958264. https://par.nsf.gov/biblio/10365829.

@article{osti_10365829,
place = {Country unknown/Code not available}, title = {Infrared Thermal Imaging-Based Crack Detection Using Deep Learning}, url = {https://par.nsf.gov/biblio/10365829}, DOI = {10.1109/ACCESS.2019.2958264}, abstractNote = {Not Available}, journal = {IEEE Access}, volume = {7}, publisher = {Institute of Electrical and Electronics Engineers}, author = {Yang, Jun and Wang, Wei and Lin, Guang and Li, Qing and Sun, Yeqing and Sun, Yixuan}, }