Jiang, Suying, Wang, Wei, Miao, Yang, Fan, Wei, and Molisch, Andreas F. A Survey of Dense Multipath and Its Impact on Wireless Systems. IEEE Open Journal of Antennas and Propagation 3. Web. doi:10.1109/OJAP.2022.3168400.

Jiang, Suying, Wang, Wei, Miao, Yang, Fan, Wei, & Molisch, Andreas F. A Survey of Dense Multipath and Its Impact on Wireless Systems. IEEE Open Journal of Antennas and Propagation, 3 (). https://doi.org/10.1109/OJAP.2022.3168400

Jiang, Suying, Wang, Wei, Miao, Yang, Fan, Wei, and Molisch, Andreas F. "A Survey of Dense Multipath and Its Impact on Wireless Systems". IEEE Open Journal of Antennas and Propagation 3 (). Country unknown/Code not available: Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/OJAP.2022.3168400. https://par.nsf.gov/biblio/10368227.

@article{osti_10368227,
place = {Country unknown/Code not available}, title = {A Survey of Dense Multipath and Its Impact on Wireless Systems}, url = {https://par.nsf.gov/biblio/10368227}, DOI = {10.1109/OJAP.2022.3168400}, abstractNote = {Not Available}, journal = {IEEE Open Journal of Antennas and Propagation}, volume = {3}, publisher = {Institute of Electrical and Electronics Engineers}, author = {Jiang, Suying and Wang, Wei and Miao, Yang and Fan, Wei and Molisch, Andreas F.}, }