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Title: Materials for ultra-efficient, high-speed optoelectronics

High-speed optoelectronics is central to many important developments in the communication, computing, sensing, imaging, and autonomous vehicle industries. With a sharp rise of attention on energy efficiency, researchers have proposed and demonstrated innovative materials, high-speed devices, and components integrated on a single platform that exhibit ultralow power consumption and ultrawide bandwidth. Recently reported material growth and device fabrication techniques offer the potential for high-density integration of optoelectronics close to the capability and cost of conventional electronics. A tremendous synergy can be attained by integrating multiple materials with superior properties on the same chip using heterogeneous integration, heteroepitaxy, nano-heteroepitaxy, and other co-packaging strategies within the complementary metal oxide semiconductor (CMOS) ecosystem. This issue ofMRS Bulletin offers an overview of the field and covers the latest developments on various ultraefficient materials, high-speed devices, their physical properties, current trends, and future directions in optoelectronics and their integration on a silicon platform.

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Publication Date:
Journal Name:
MRS Bulletin
Page Range or eLocation-ID:
p. 475-484
Cambridge University Press (CUP)
Sponsoring Org:
National Science Foundation
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