Accurate and efficient predictions of the quasiparticle properties of complex materials remain a major challenge due to the convergence issue and the unfavorable scaling of the computational cost with respect to the system size. Quasiparticle
High-speed optoelectronics is central to many important developments in the communication, computing, sensing, imaging, and autonomous vehicle industries. With a sharp rise of attention on energy efficiency, researchers have proposed and demonstrated innovative materials, high-speed devices, and components integrated on a single platform that exhibit ultralow power consumption and ultrawide bandwidth. Recently reported material growth and device fabrication techniques offer the potential for high-density integration of optoelectronics close to the capability and cost of conventional electronics. A tremendous synergy can be attained by integrating multiple materials with superior properties on the same chip using heterogeneous integration, heteroepitaxy, nano-heteroepitaxy, and other co-packaging strategies within the complementary metal oxide semiconductor (CMOS) ecosystem. This issue of
- Publication Date:
- NSF-PAR ID:
- 10369766
- Journal Name:
- MRS Bulletin
- Volume:
- 47
- Issue:
- 5
- Page Range or eLocation-ID:
- p. 475-484
- ISSN:
- 0883-7694
- Publisher:
- Cambridge University Press (CUP)
- Sponsoring Org:
- National Science Foundation
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