Dhananjay, Krithika, Pavlidis, Vasilis F., Coskun, Ayse K., and Salman, Emre. High Bandwidth Thermal Covert Channel in 3-D-Integrated Multicore Processors. Retrieved from https://par.nsf.gov/biblio/10379543. IEEE Transactions on Very Large Scale Integration (VLSI) Systems 30.11 Web. doi:10.1109/TVLSI.2022.3203430.

Dhananjay, Krithika, Pavlidis, Vasilis F., Coskun, Ayse K., & Salman, Emre. High Bandwidth Thermal Covert Channel in 3-D-Integrated Multicore Processors. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 30 (11). Retrieved from https://par.nsf.gov/biblio/10379543. https://doi.org/10.1109/TVLSI.2022.3203430

Dhananjay, Krithika, Pavlidis, Vasilis F., Coskun, Ayse K., and Salman, Emre. "High Bandwidth Thermal Covert Channel in 3-D-Integrated Multicore Processors". IEEE Transactions on Very Large Scale Integration (VLSI) Systems 30 (11). Country unknown/Code not available. https://doi.org/10.1109/TVLSI.2022.3203430. https://par.nsf.gov/biblio/10379543.

@article{osti_10379543,
place = {Country unknown/Code not available}, title = {High Bandwidth Thermal Covert Channel in 3-D-Integrated Multicore Processors}, url = {https://par.nsf.gov/biblio/10379543}, DOI = {10.1109/TVLSI.2022.3203430}, abstractNote = {}, journal = {IEEE Transactions on Very Large Scale Integration (VLSI) Systems}, volume = {30}, number = {11}, author = {Dhananjay, Krithika and Pavlidis, Vasilis F. and Coskun, Ayse K. and Salman, Emre}, }