Roy, Ankita, Luktuke, Amey, Chawla, Nikhilesh, and Ankit, Kumar. Predicting the Cu6Sn5 Growth Kinetics During Thermal Aging of Cu-Sn Solder Joints Using Simplistic Kinetic Modeling. Retrieved from https://par.nsf.gov/biblio/10383505. Journal of Electronic Materials 51.7 Web. doi:10.1007/s11664-022-09643-2.

Roy, Ankita, Luktuke, Amey, Chawla, Nikhilesh, & Ankit, Kumar. Predicting the Cu6Sn5 Growth Kinetics During Thermal Aging of Cu-Sn Solder Joints Using Simplistic Kinetic Modeling. Journal of Electronic Materials, 51 (7). Retrieved from https://par.nsf.gov/biblio/10383505. https://doi.org/10.1007/s11664-022-09643-2

Roy, Ankita, Luktuke, Amey, Chawla, Nikhilesh, and Ankit, Kumar. "Predicting the Cu6Sn5 Growth Kinetics During Thermal Aging of Cu-Sn Solder Joints Using Simplistic Kinetic Modeling". Journal of Electronic Materials 51 (7). Country unknown/Code not available. https://doi.org/10.1007/s11664-022-09643-2. https://par.nsf.gov/biblio/10383505.

@article{osti_10383505,
place = {Country unknown/Code not available}, title = {Predicting the Cu6Sn5 Growth Kinetics During Thermal Aging of Cu-Sn Solder Joints Using Simplistic Kinetic Modeling}, url = {https://par.nsf.gov/biblio/10383505}, DOI = {10.1007/s11664-022-09643-2}, abstractNote = {}, journal = {Journal of Electronic Materials}, volume = {51}, number = {7}, author = {Roy, Ankita and Luktuke, Amey and Chawla, Nikhilesh and Ankit, Kumar}, }