Fast electromigration stress analysis considering spatial Joule heating effects
- Award ID(s):
- 1816361
- NSF-PAR ID:
- 10393652
- Date Published:
- Journal Name:
- Proc. Asia South Pacific Design Automation Conference (ASP-DAC’22)
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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