Etching Process to Reduce Interlamination Short Circuits and Core Loss Comparison for Tape-Wound Cut Cores
- Award ID(s):
- 1939144
- PAR ID:
- 10396161
- Date Published:
- Journal Name:
- 2022 IEEE 13th International Symposium on Power Electronics for Distributed Generation Systems (PEDG)
- Page Range / eLocation ID:
- 1 to 6
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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