Goswami, Subhadip, Rimoldi, Martino, Anderson, Ryther, Lee, Changmin, Li, Xinlin, Li, Alice, Deria, Pravas, Chen, Lin X., Schaller, Richard D., Gómez-Gualdrón, Diego A., Farha, Omar K., and Hupp, Joseph T. Toward Ideal Metal–Organic Framework Thin-Film Growth via Automated Layer-by-Layer Deposition: Examples Based on Perylene Diimide Linkers. Retrieved from https://par.nsf.gov/biblio/10399142. Chemistry of Materials 34.21 Web. doi:10.1021/acs.chemmater.2c01753.
Goswami, Subhadip, Rimoldi, Martino, Anderson, Ryther, Lee, Changmin, Li, Xinlin, Li, Alice, Deria, Pravas, Chen, Lin X., Schaller, Richard D., Gómez-Gualdrón, Diego A., Farha, Omar K., & Hupp, Joseph T. Toward Ideal Metal–Organic Framework Thin-Film Growth via Automated Layer-by-Layer Deposition: Examples Based on Perylene Diimide Linkers. Chemistry of Materials, 34 (21). Retrieved from https://par.nsf.gov/biblio/10399142. https://doi.org/10.1021/acs.chemmater.2c01753
Goswami, Subhadip, Rimoldi, Martino, Anderson, Ryther, Lee, Changmin, Li, Xinlin, Li, Alice, Deria, Pravas, Chen, Lin X., Schaller, Richard D., Gómez-Gualdrón, Diego A., Farha, Omar K., and Hupp, Joseph T.
"Toward Ideal Metal–Organic Framework Thin-Film Growth via Automated Layer-by-Layer Deposition: Examples Based on Perylene Diimide Linkers". Chemistry of Materials 34 (21). Country unknown/Code not available. https://doi.org/10.1021/acs.chemmater.2c01753.https://par.nsf.gov/biblio/10399142.
@article{osti_10399142,
place = {Country unknown/Code not available},
title = {Toward Ideal Metal–Organic Framework Thin-Film Growth via Automated Layer-by-Layer Deposition: Examples Based on Perylene Diimide Linkers},
url = {https://par.nsf.gov/biblio/10399142},
DOI = {10.1021/acs.chemmater.2c01753},
abstractNote = {},
journal = {Chemistry of Materials},
volume = {34},
number = {21},
author = {Goswami, Subhadip and Rimoldi, Martino and Anderson, Ryther and Lee, Changmin and Li, Xinlin and Li, Alice and Deria, Pravas and Chen, Lin X. and Schaller, Richard D. and Gómez-Gualdrón, Diego A. and Farha, Omar K. and Hupp, Joseph T.},
}
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