ReSiPI: A Reconfigurable Silicon-Photonic 2.5D Chiplet Network with PCMs for Energy-Efficient Interposer Communication
- Award ID(s):
- 2046226
- NSF-PAR ID:
- 10409998
- Date Published:
- Journal Name:
- Proc. IEEE/ACM International Conference on Computer-Aided Design (ICCAD)
- Page Range / eLocation ID:
- 1 to 9
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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Accepted Manuscript1.0
- Conference Paper:
- https://doi.org/10.1145/3508352.3549432
