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Title: Molecular dynamics studies of sluggish grain boundary diffusion in equiatomic FeNiCrCoCu high-entropy alloy
Award ID(s):
1847780
PAR ID:
10416946
Author(s) / Creator(s):
; ;
Date Published:
Journal Name:
Journal of Materials Science
ISSN:
0022-2461
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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