Wafer-Scale Full-Coverage Self-Limiting Assembly of Particles on Flexible Substrates
- Award ID(s):
- 2003077
- PAR ID:
- 10425819
- Date Published:
- Journal Name:
- ACS Applied Materials & Interfaces
- Volume:
- 14
- Issue:
- 40
- ISSN:
- 1944-8244
- Page Range / eLocation ID:
- 46095 to 46102
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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