- Award ID(s):
- 1653396
- NSF-PAR ID:
- 10433056
- Date Published:
- Journal Name:
- 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
- Page Range / eLocation ID:
- 166 to 172
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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