Xi, Chengjie, Khan, Aslam A., Jessurun, Nathan, Vashisthan, Nidish, Tehranipoor, Mark M., and Asadizanjani, Navid. Physical Assurance for Heterogeneous Integration: Challenges and Opportunities. Retrieved from https://par.nsf.gov/biblio/10436555. IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) . Web. doi:10.1109/ipfa55383.2022.9915749.

Xi, Chengjie, Khan, Aslam A., Jessurun, Nathan, Vashisthan, Nidish, Tehranipoor, Mark M., & Asadizanjani, Navid. Physical Assurance for Heterogeneous Integration: Challenges and Opportunities. IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), (). Retrieved from https://par.nsf.gov/biblio/10436555. https://doi.org/10.1109/ipfa55383.2022.9915749

Xi, Chengjie, Khan, Aslam A., Jessurun, Nathan, Vashisthan, Nidish, Tehranipoor, Mark M., and Asadizanjani, Navid. "Physical Assurance for Heterogeneous Integration: Challenges and Opportunities". IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (). Country unknown/Code not available. https://doi.org/10.1109/ipfa55383.2022.9915749. https://par.nsf.gov/biblio/10436555.

@article{osti_10436555,
place = {Country unknown/Code not available}, title = {Physical Assurance for Heterogeneous Integration: Challenges and Opportunities}, url = {https://par.nsf.gov/biblio/10436555}, DOI = {10.1109/ipfa55383.2022.9915749}, abstractNote = {}, journal = {IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)}, author = {Xi, Chengjie and Khan, Aslam A. and Jessurun, Nathan and Vashisthan, Nidish and Tehranipoor, Mark M. and Asadizanjani, Navid}, }