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A silver nanowire (AgNW) based conductor is a promising component for flexible and stretchable electronics. A wide range of flexible/stretchable devices using AgNW conductors has been demonstrated recently. High-resolution, high-throughput printing of AgNWs remains a critical challenge. Electrohydrodynamic (EHD) printing has been developed as a promising technique to print different materials on a variety of substrates with high resolution. Here, AgNW ink was developed for EHD printing. The printed features can be controlled by several parameters including AgNW concentration, ink viscosity, printing speed, stand-off distance, etc . With this method, AgNW patterns can be printed on a range of substrates, e.g. paper, polyethylene terephthalate (PET), glass, polydimethylsiloxane (PDMS), etc. First, AgNW samples on PDMS were characterized under bending and stretching. Then AgNW heaters and electrocardiogram (ECG) electrodes were fabricated to demonstrate the potential of this printing technique for AgNW-based flexible and stretchable devices.
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Direct Fabrication of VIA Interconnects by Electrohydrodynamic Printing for Multi‐Layer 3D Flexible and Stretchable Electronics
Abstract Multi‐layer electrical interconnects are critical for the development of integrated soft wearable electronic systems, in which functional devices from different layers need to be connected together by vertical interconnects. In this work, electrohydrodynamic (EHD) printing technology is studied to achieve multi‐layer flexible and stretchable electronics by direct printing vertical interconnects as vertical interconnect accesses (VIAs) using a low‐melting‐point metal alloy. The EHD printed metallic vertical interconnection represents a promising way for the direct fabrication of multilayer integrated electronics with metallic conductivity and excellent flexibility and stretchability. By controlling the printing conditions, vertical interconnects that can bridge different heights can be fabricated. To achieve reliable VIA connections under bending and stretching conditions, an epoxy protective structure is printed around the VIA interconnects to form a core‐shell structure. A stable electrical response is achieved under hundreds of bending cycles and during stretching/releasing cycles in a large range of tensile strain (0–40%) for the printed conductors with VIA interconnects. A few multi‐layer devices, including a multiple layer heater, and a pressure‐based touch panel are fabricated to demonstrate the capability of the EHD printing for the direct fabrication of vertical metallic VIA interconnects for flexible and stretchable devices.
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- Award ID(s):
- 1728370
- PAR ID:
- 10449733
- Publisher / Repository:
- Wiley Blackwell (John Wiley & Sons)
- Date Published:
- Journal Name:
- Advanced Materials Technologies
- Volume:
- 6
- Issue:
- 9
- ISSN:
- 2365-709X
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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