Design and direct fabrication of high‐performance thermosets and composites via 3D printing are highly desirable in engineering applications. Most 3D printed thermosetting polymers to date suffer from poor mechanical properties and low printing speed. Here, a novel ink for high‐speed 3D printing of high‐performance epoxy thermosets via a two‐stage curing approach is presented. The ink containing photocurable resin and thermally curable epoxy resin is used for the digital light processing (DLP) 3D printing. After printing, the part is thermally cured at elevated temperature to yield an interpenetrating polymer network epoxy composite, whose mechanical properties are comparable to engineering epoxy. The printing speed is accelerated by the continuous liquid interface production assisted DLP 3D printing method, achieving a printing speed as high as 216 mm h−1. It is also demonstrated that 3D printing structural electronics can be achieved by combining the 3D printed epoxy composites with infilled silver ink in the hollow channels. The new 3D printing method via two‐stage curing combines the attributes of outstanding printing speed, high resolution, low volume shrinkage, and excellent mechanical properties, and provides a new avenue to fabricate 3D thermosetting composites with excellent mechanical properties and high efficiency toward high‐performance and functional applications.
This effort provides a multifaceted analysis of the structural changes and material dynamics of thermally driven softening and curing of three distinct phthalonitrile (PN) resins that cross‐link into thermally stable and oxidation‐resistant thermosets. Although this material system has yielded a large subset of fire‐retardant composites that require facile processing and low‐temperature curing, to date, insufficient information had been available on the fundamental processes that drive their softening and curing stages. Our approach conducted a complementary analysis the chemistry, monomer mobility, and rheology of three PN polymers in order to correlate the curing processes with corresponding structural and behavioral transformations of thermosets. We focused on PNs with a bisphenol S backbone, a bisphenol A (PEEKTM‐like) backbone, and a resveratrol backbone. We relied on quasi‐elastic neutron scattering (QENS) in order to analyze the in situ dynamics and self‐diffusion properties of PN monomers, and to track changes in their mobilities during cross‐linking and staging. Our analysis facilitates proper control over the staging and final curing of these resins and enables more efficient processing of these thermosets.
more » « less- NSF-PAR ID:
- 10454498
- Publisher / Repository:
- Wiley Blackwell (John Wiley & Sons)
- Date Published:
- Journal Name:
- Journal of Polymer Science
- Volume:
- 58
- Issue:
- 24
- ISSN:
- 2642-4150
- Page Range / eLocation ID:
- p. 3419-3431
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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