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Title: ASSESSMENT OF RELIABILITY ENHANCEMENT IN HIGH-POWER CPUs AND GPUs USING DYNAMIC DIRECT-TO-CHIP LIQUID COOLING
Award ID(s):
2209751
NSF-PAR ID:
10454830
Author(s) / Creator(s):
; ; ; ; ; ;
Date Published:
Journal Name:
Journal of Enhanced Heat Transfer
Volume:
29
Issue:
8
ISSN:
1065-5131
Page Range / eLocation ID:
1 to 13
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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