Shahi, Pardeep, Mathew, Amith, Akash, Saini, Satyam, Bansode, Pratik, Kasukurthy, Rajesh, and Agonafer, Dereje. ASSESSMENT OF RELIABILITY ENHANCEMENT IN HIGH-POWER CPUs AND GPUs USING DYNAMIC DIRECT-TO-CHIP LIQUID COOLING. Retrieved from https://par.nsf.gov/biblio/10454830. Journal of Enhanced Heat Transfer 29.8 Web. doi:10.1615/JEnhHeatTransf.2022043858.

Shahi, Pardeep, Mathew, Amith, Akash, Saini, Satyam, Bansode, Pratik, Kasukurthy, Rajesh, & Agonafer, Dereje. ASSESSMENT OF RELIABILITY ENHANCEMENT IN HIGH-POWER CPUs AND GPUs USING DYNAMIC DIRECT-TO-CHIP LIQUID COOLING. Journal of Enhanced Heat Transfer, 29 (8). Retrieved from https://par.nsf.gov/biblio/10454830. https://doi.org/10.1615/JEnhHeatTransf.2022043858

Shahi, Pardeep, Mathew, Amith, Akash, Saini, Satyam, Bansode, Pratik, Kasukurthy, Rajesh, and Agonafer, Dereje. "ASSESSMENT OF RELIABILITY ENHANCEMENT IN HIGH-POWER CPUs AND GPUs USING DYNAMIC DIRECT-TO-CHIP LIQUID COOLING". Journal of Enhanced Heat Transfer 29 (8). Country unknown/Code not available. https://doi.org/10.1615/JEnhHeatTransf.2022043858. https://par.nsf.gov/biblio/10454830.

@article{osti_10454830,
place = {Country unknown/Code not available}, title = {ASSESSMENT OF RELIABILITY ENHANCEMENT IN HIGH-POWER CPUs AND GPUs USING DYNAMIC DIRECT-TO-CHIP LIQUID COOLING}, url = {https://par.nsf.gov/biblio/10454830}, DOI = {10.1615/JEnhHeatTransf.2022043858}, abstractNote = {}, journal = {Journal of Enhanced Heat Transfer}, volume = {29}, number = {8}, author = {Shahi, Pardeep and Mathew, Amith and Akash and Saini, Satyam and Bansode, Pratik and Kasukurthy, Rajesh and Agonafer, Dereje}, }