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This content will become publicly available on May 23, 2024

Title: Application of TVS Models for SEED Simulation of a Variety of TVS Devices
Award ID(s):
1916535
NSF-PAR ID:
10465867
Author(s) / Creator(s):
; ; ; ; ;
Date Published:
Journal Name:
2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC)
Page Range / eLocation ID:
1 to 4
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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