Analysis of Electromagnetic Interference Problems Caused by Split Reference Plane on High-Speed Multilayer Boards
- Award ID(s):
- 1916535
- PAR ID:
- 10465871
- Date Published:
- Journal Name:
- 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)
- Page Range / eLocation ID:
- 355 to 360
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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