Anjajo, Kalkidan W., Xu, Yang, Xia, Shengxuan, He, Yuchu, Zhou, Haicheng, Wang, Hanfeng, Park, Jonghyun, and Hwang, Chulsoon. Static I-V based PIM Evaluation for Spring and Fabric-over-Foam Contacts. Retrieved from https://par.nsf.gov/biblio/10465880. 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) . Web. doi:10.1109/EMCSIPI50001.2023.10241745.

Anjajo, Kalkidan W., Xu, Yang, Xia, Shengxuan, He, Yuchu, Zhou, Haicheng, Wang, Hanfeng, Park, Jonghyun, & Hwang, Chulsoon. Static I-V based PIM Evaluation for Spring and Fabric-over-Foam Contacts. 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), (). Retrieved from https://par.nsf.gov/biblio/10465880. https://doi.org/10.1109/EMCSIPI50001.2023.10241745

Anjajo, Kalkidan W., Xu, Yang, Xia, Shengxuan, He, Yuchu, Zhou, Haicheng, Wang, Hanfeng, Park, Jonghyun, and Hwang, Chulsoon. "Static I-V based PIM Evaluation for Spring and Fabric-over-Foam Contacts". 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) (). Country unknown/Code not available. https://doi.org/10.1109/EMCSIPI50001.2023.10241745. https://par.nsf.gov/biblio/10465880.

@article{osti_10465880,
place = {Country unknown/Code not available}, title = {Static I-V based PIM Evaluation for Spring and Fabric-over-Foam Contacts}, url = {https://par.nsf.gov/biblio/10465880}, DOI = {10.1109/EMCSIPI50001.2023.10241745}, abstractNote = {}, journal = {2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)}, author = {Anjajo, Kalkidan W. and Xu, Yang and Xia, Shengxuan and He, Yuchu and Zhou, Haicheng and Wang, Hanfeng and Park, Jonghyun and Hwang, Chulsoon}, }