Hardware-Software Co-Design for On-Chip Learning in AI Systems
- Award ID(s):
- 1937419
- PAR ID:
- 10487894
- Publisher / Repository:
- ACM
- Date Published:
- Journal Name:
- Asia and South Pacific Design Automation Conference
- ISBN:
- 9781450397834
- Page Range / eLocation ID:
- 624 to 631
- Format(s):
- Medium: X
- Location:
- Tokyo Japan
- Sponsoring Org:
- National Science Foundation
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