Title: Hardware-Software Co-Design for On-Chip Learning in AI Systems
Award ID(s):
1937419
PAR ID:
10487894
Author(s) / Creator(s):
; ; ;
Publisher / Repository:
ACM
Date Published:
Journal Name:
Asia and South Pacific Design Automation Conference
ISBN:
9781450397834
Page Range / eLocation ID:
624 to 631
Format(s):
Medium: X
Location:
Tokyo Japan
Sponsoring Org:
National Science Foundation
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