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Title: Bond-pad damage in ultrasonic wedge bonding
Award ID(s):
1728652
PAR ID:
10489418
Author(s) / Creator(s):
; ;
Publisher / Repository:
Pergamon
Date Published:
Journal Name:
Microelectronics Reliability
Volume:
152
Issue:
C
ISSN:
0026-2714
Page Range / eLocation ID:
115279
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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