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Title: Modeling and Design of Dual-Purpose MIV in Monolithic 3D IC
Award ID(s):
2105164
PAR ID:
10491147
Author(s) / Creator(s):
 ;  
Publisher / Repository:
Institute of Electrical and Electronics Engineers
Date Published:
Journal Name:
IEEE Access
Volume:
12
ISSN:
2169-3536
Format(s):
Medium: X Size: p. 23066-23080
Size(s):
p. 23066-23080
Sponsoring Org:
National Science Foundation
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