Ding, Huan, Emanet, Selami, Chen, Yehong, and Guo, Shengmin. The potential benefit of pseudo high thermal conductivity for laser powder bed fusion additive manufacturing. Retrieved from https://par.nsf.gov/biblio/10496498. Materials Research Letters 11.10 Web. doi:10.1080/21663831.2023.2243990.

Ding, Huan, Emanet, Selami, Chen, Yehong, & Guo, Shengmin. The potential benefit of pseudo high thermal conductivity for laser powder bed fusion additive manufacturing. Materials Research Letters, 11 (10). Retrieved from https://par.nsf.gov/biblio/10496498. https://doi.org/10.1080/21663831.2023.2243990

Ding, Huan, Emanet, Selami, Chen, Yehong, and Guo, Shengmin. "The potential benefit of pseudo high thermal conductivity for laser powder bed fusion additive manufacturing". Materials Research Letters 11 (10). Country unknown/Code not available: https://www.tandfonline.com/doi/full/10.1080/21663831.2023.2243990. https://doi.org/10.1080/21663831.2023.2243990. https://par.nsf.gov/biblio/10496498.

@article{osti_10496498,
place = {Country unknown/Code not available}, title = {The potential benefit of pseudo high thermal conductivity for laser powder bed fusion additive manufacturing}, url = {https://par.nsf.gov/biblio/10496498}, DOI = {10.1080/21663831.2023.2243990}, abstractNote = {}, journal = {Materials Research Letters}, volume = {11}, number = {10}, publisher = {https://www.tandfonline.com/doi/full/10.1080/21663831.2023.2243990}, author = {Ding, Huan and Emanet, Selami and Chen, Yehong and Guo, Shengmin}, }