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Title: Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration
Award ID(s):
2105164
PAR ID:
10496931
Author(s) / Creator(s):
;
Publisher / Repository:
IEEE
Date Published:
ISBN:
979-8-3503-3475-3
Page Range / eLocation ID:
1 to 8
Format(s):
Medium: X
Location:
San Francisco, CA, USA
Sponsoring Org:
National Science Foundation
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