Multiscale Process Modeling of Semicrystalline PEEK for Tailored Thermomechanical Properties
- Award ID(s):
- 2145387
- PAR ID:
- 10501121
- Publisher / Repository:
- ASC Applied Engineering Materials
- Date Published:
- Journal Name:
- ACS Applied Engineering Materials
- Volume:
- 1
- Issue:
- 11
- ISSN:
- 2771-9545
- Page Range / eLocation ID:
- 3167 to 3177
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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