Jin, Wentian, Chen, Liang, Lamichhane, Subed, Kavousi, Mohammadamir, and Tan, Sheldon X.-D. HierPINN-EM: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnects Using Hierarchical Physics-Informed Neural Network. Proc. IEEE/ACM International Conf. on Computer-Aided Design (ICCAD’22) . Web. doi:10.1145/3508352.3549371.

Jin, Wentian, Chen, Liang, Lamichhane, Subed, Kavousi, Mohammadamir, & Tan, Sheldon X.-D. HierPINN-EM: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnects Using Hierarchical Physics-Informed Neural Network. Proc. IEEE/ACM International Conf. on Computer-Aided Design (ICCAD’22), (). https://doi.org/10.1145/3508352.3549371

Jin, Wentian, Chen, Liang, Lamichhane, Subed, Kavousi, Mohammadamir, and Tan, Sheldon X.-D. "HierPINN-EM: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnects Using Hierarchical Physics-Informed Neural Network". Proc. IEEE/ACM International Conf. on Computer-Aided Design (ICCAD’22) (). Country unknown/Code not available: ACM. https://doi.org/10.1145/3508352.3549371. https://par.nsf.gov/biblio/10501134.

@article{osti_10501134,
place = {Country unknown/Code not available}, title = {HierPINN-EM: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnects Using Hierarchical Physics-Informed Neural Network}, url = {https://par.nsf.gov/biblio/10501134}, DOI = {10.1145/3508352.3549371}, abstractNote = {}, journal = {Proc. IEEE/ACM International Conf. on Computer-Aided Design (ICCAD’22)}, publisher = {ACM}, author = {Jin, Wentian and Chen, Liang and Lamichhane, Subed and Kavousi, Mohammadamir and Tan, Sheldon X.-D.}, }