Disassembling Software Instruction Types through Impedance Side-channel Analysis

Awal, Md Sadik; Rahman, Md Tauhidur

doi:10.1109/HOST55118.2023.10133318

Attention:

The NSF Public Access Repository (NSF-PAR) system and access will be unavailable from 11:00 PM ET on Thursday, October 10 until 2:00 AM ET on Friday, October 11 due to maintenance. We apologize for the inconvenience.

Explore Research Products in the NSF-PAR

+ Advanced Search

Citation Details

Disassembling Software Instruction Types through Impedance Side-channel Analysis

Award ID(s):: 2114200

NSF-PAR ID:: 10506961

Author(s) / Creator(s):: Awal, Md Sadik; Rahman, Md Tauhidur

Publisher / Repository:: IEEE

Date Published:: 2023-05-01

ISBN:: 979-8-3503-0062-8

Page Range / eLocation ID:: 227 to 237

Format(s):: Medium: X

Location:: San Jose, CA, USA

Sponsoring Org:: National Science Foundation

Conference Paper:
https://doi.org/10.1109/HOST55118.2023.10133318

Last Name:

First Name:

Search Results
Selected Authors

Type in a name, or the first few letters of a name, in one or both of appropriate search boxes above and select the search button. An attempt will be made to match authors that most closely relate to the text you typed.

No authors are currently selected. Choosing "Select These Authors" will enter a blank value for author search in the parent form.

Last Name:

First Name:

Search Results
Selected Editors

Type in a name, or the first few letters of a name, in one or both of appropriate search boxes above and select the search button. An attempt will be made to match editors that most closely relate to the text you typed.

No editors are currently selected. Choosing "Select These Editors" will enter a blank value for editor search in the parent form.

More Like this