No Blind Spots: On the Resiliency of Device Fingerprints to Hardware Warm-Up Through Sequential Transfer Learning
- Award ID(s):
- 2003273
- PAR ID:
- 10512146
- Publisher / Repository:
- ACM
- Date Published:
- ISBN:
- 9798400705823
- Page Range / eLocation ID:
- 134 to 144
- Format(s):
- Medium: X
- Location:
- Seoul Republic of Korea
- Sponsoring Org:
- National Science Foundation
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