Radiation susceptibility of electronics has always been about probing electrical properties in either transient or time-accumulated phenomena. As the size and complexity of electronic chips or systems increase, detection of the most vulnerable regions becomes more time consuming and challenging. In this study, we hypothesize that localized mechanical stress, if overlapping electrically sensitive regions, can make electronic devices more susceptible to radiation. Accordingly, we develop an indirect technique to map mechanical and electrical hotspots to identify radiation-susceptible regions of the operational amplifier AD844 to ionizing radiation. Mechanical susceptibility is measured using pulsed thermal phase analysis via lock-in thermography and electrical biasing is used to identify electrically relevant regions. A composite score of electrical and mechanical sensitivity was constructed to serve as a metric for ionizing radiation susceptibility. Experimental results, compared against the literature, indicate effectiveness of the new technique in the rapid detection of radiation-vulnerable regions. The findings could be attractive for larger systems, for which traditional analysis would take —two to three orders of magnitude more time to complete. However, the indirect nature of the technique makes the study more approximate and in need for more consistency and validation efforts.
Understanding the single event effects (SEE) sensitivity of microelectronic devices and circuits is essential for long-term mission success in ionizing radiation environments. SEEs occur when a single ionizing particle strikes a device with enough energy to cause anomalous malfunction or even a catastrophic failure event. It is conventionally viewed as an electrical phenomenon, whereas this study investigates the possible role of multi-physics. Specifically, we show that localized mechanical stress in electronic devices significantly impacts the degree of SEE sensitivity. We present a technique that indirectly maps both electrical and mechanical field localization to spatially map SEE sensitivity without any need for radiation test sources. It is demonstrated on the operational amplifier LM124 under both pristine and stressed conditions. To validate our hypothesis, our experimental results are compared with those obtained from the well-established pulsed laser SEE technique. Excellent agreement between these results supports our hypothesis that SEE susceptibility may have fundamental roots in both electrical and mechanical fields. Therefore, the ability to map the localizations in these fields may indirectly map the SEE sensitivity of large area electronics, which is very expensive in time and resources.
more » « less- NSF-PAR ID:
- 10513075
- Publisher / Repository:
- The Electrochemical Society
- Date Published:
- Journal Name:
- ECS Journal of Solid State Science and Technology
- Volume:
- 13
- Issue:
- 6
- ISSN:
- 2162-8769
- Format(s):
- Medium: X Size: Article No. 065004
- Size(s):
- Article No. 065004
- Sponsoring Org:
- National Science Foundation
More Like this
-
more » « less
-
Heuristic Detection of the Most Vulnerable Regions in Electronic Devices for Radiation SurvivabilityAs electronic systems become larger and more complex, detection of the most vulnerable regions (MVR) to radiation exposure becomes more difficult and time consuming. We present a heuristic approach where the mechanical and thermal aspects of devices are exploited to quickly identify MVRs. Our approach involves the topological mapping of two device conditions. The first condition identifies regions with the highest mechanical strain or density of defects and interfaces via thermal wave probing and phase analysis. The second condition identifies regions with high electrical field. It is hypothesized that the region with the highest thermal wave penetration resistance and electrical field will exhibit the highest sensitivity to incoming radiation for single events and potentially, total ionizing dose. Our approach implements a simplistic design that improves analysis time by ∼2–3 orders of magnitude over current radiation sensitivity mapping methods. The design is demonstrated on the well-studied operational amplifier LM124, which shows agreement with the literature in identifying sensitive transistors–QR1, Q9, and Q18–with relatively high phase percentile values (>70%) and ΔT percentiles (>50%), satisfying conditions for elevated radiation susceptibility. This is followed by experimental results on a static random access memory (HM-6504) and a Xilinx Artix-7 35 T system on a chip.more » « less
-
We present a review of the published experimental and simulation radiation damage results in Ga 2 O 3 . All of the polytypes of Ga 2 O 3 are expected to show similar radiation resistance as GaN and SiC, considering their average bond strengths. However, this is not enough to explain the orders of magnitude difference of the relative resistance to radiation damage of these materials compared to GaAs and dynamic annealing of defects is much more effective in Ga 2 O 3 . It is important to examine the effect of all types of radiation, given that Ga 2 O 3 devices will potentially be deployed both in space and terrestrial applications. Octahedral gallium monovacancies are the main defects produced under most radiation conditions because of the larger cross-section for interaction compared to oxygen vacancies. Proton irradiation introduces two main paramagnetic defects in Ga 2 O 3 , which are stable at room temperature. Charge carrier removal can be explained by Fermi-level pinning far from the conduction band minimum due to gallium interstitials (Ga i ), vacancies (V Ga ), and antisites (Ga O ). One of the most important parameters to establish is the carrier removal rate for each type of radiation, since this directly impacts the current in devices such as transistors or rectifiers. When compared to the displacement damage predicted by the Stopping and Range of Ions in Matter(SRIM) code, the carrier removal rates are generally much lower and take into account the electrical nature of the defects created. With few experimental or simulation studies on single event effects (SEE) in Ga 2 O 3 , it is apparent that while other wide bandgap semiconductors like SiC and GaN are robust against displacement damage and total ionizing dose, they display significant vulnerability to single event effects at high Linear Energy Transfer (LET) and at much lower biases than expected. We have analyzed the transient response of β -Ga 2 O 3 rectifiers to heavy-ion strikes via TCAD simulations. Using field metal rings improves the breakdown voltage and biasing those rings can help control the breakdown voltage. Such biased rings help in the removal of the charge deposited by the ion strike.more » « less
-
Radiation poses known and serious risks to smallsat survivability and mission duration, with effects falling into two categories: long-term total ionizing dose (TID) and instantaneous single event effects (SEE). Although literature exists on the topic of addressing TID in smallsats, few resources exist for addressing SEEs. Many varieties of SEEs exist, such as bit upsets and latch ups, which can occur in any electronic component containing active semiconductors (such as transistors). SEE consequences range from benign to destructive, so mission reliability can be enhanced by implementing fault protection strategies based on predicted SEE rates. Unfortunately, SEE rates are most reliably estimated through experimental testing that is often too costly for smallsat-scale missions. Prior test data published by larger programs exist, but may be sparse or incompatible with the environment of a particular mission. Despite these limitations, a process may be followed to gain insights and make informed design decisions for smallsats in the absence of hardware testing capabilities or similar test data. This process is: (1) Define the radiation environment; (2) identify the most critical and/or susceptible components on a spacecraft; (3) perform a search for compatible prior test data and/or component class data; (4) evaluate mission-specific SEE rates from available data; (5) study the rates alongside the mission requirements to identify high-risk areas of potential mitigation. The methodology developed in this work is based on the multi-institutional, National Science Foundation (NSF) Space Weather Atmospheric Reconfigurable Multiscale Experiment (SWARM-EX) mission. The steps taken during SWARM-EX’s radiation analysis alongside the detailed methodology serve as a case study for how these techniques can be applied to increasing the reliability of a university-scale smallsat mission.more » « less
-
more » « less
NiO/Ga2O3 heterojunction rectifiers were exposed to 1 Mrad fluences of Co-60 γ-rays either with or without reverse biases. While there is a small component of Compton electrons (600 keV), generated via the interaction of 1.17 and 1.33 MeV gamma photons with the semiconductor, which in turn can lead to displacement damage, most of the energy is lost to ionization. The effect of the exposure to radiation is a 1000× reduction in forward current and a 100× increase in reverse current in the rectifiers, which is independent of whether the devices were biased during this step. The on–off ratio is also reduced by almost five orders of magnitude. There is a slight reduction in carrier concentration in the Ga2O3 drift region, with an effective carrier removal rate of <4 cm−1. The changes in electrical characteristics are reversible by application of short forward current pulses during repeated measurement of the current–voltage characteristics at room temperature. There are no permanent total ionizing dose effects present in the rectifiers to 1 Mad fluences, which along with their resistance to displacement damage effects indicate that these devices may be well-suited to harsh terrestrial and space radiation applications if appropriate bias sequences are implemented to reverse the radiation-induced changes.
