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This content will become publicly available on August 1, 2025

Title: A Novel Delay-Aware Packing Algorithm for FPGA Architecture Using RFET
Award ID(s):
2219753
PAR ID:
10516759
Author(s) / Creator(s):
; ; ; ;
Publisher / Repository:
IEEE 67th International Midwest Symposium on Circuits and Systems (MWSCAS)
Date Published:
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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