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Bulk nanostructured metals introduced by severe plastic deformation contain an excess of lattice defects. A nanostructured copper (Cu) processed by a high-pressure torsion technique was examined during in situ heating to investigate microstructural relaxation and quantify the evolution of microstructural parameters using high-energy synchrotron microbeam X-ray diffraction. While general microstructural relaxations, such as recovery, recrystallization, and subsequent grain growth, were observed, the key microstructural parameters, including grain size, microstrain, dislocation density, and thermal expansion coefficient, and their changes at critical temperatures were uniquely described and quantified through diffraction data. Based on this analysis, the stored energies driving thermally activated microstructural changes were estimated for individual defect types — grain boundaries, dislocations, and vacancies — that are expected to significantly influence the relaxation behavior of nanostructured Cu. This study demonstrates the effectiveness of diffraction characterization techniques for gaining a comprehensive understanding of the thermal stability of bulk nanostructured materials.
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Comparison of the Thermal Stability in Equal‐Channel‐Angular‐Pressed and High‐Pressure‐Torsion‐Processed Fe–21Cr–5Al Alloy
Nanostructured steels are expected to have enhanced irradiation tolerance and improved strength. However, they suffer from poor microstructural stability at elevated temperatures. In this study, Fe–21Cr–5Al–0.026C (wt%) Kanthal D (KD) alloy belonging to a class of (FeCrAl) alloys considered for accident‐tolerant fuel cladding in light‐water reactors is nanostructured using two severe plastic deformation techniques of equal‐channel angular pressing (ECAP) and high‐pressure torsion (HPT), and their thermal stability between 500–700 °C is studied and compared. ECAP KD is found to be thermally stable up to 500 °C, whereas HPT KD is unstable at 500 °C. Microstructural characterization reveals that ECAP KD undergoes recovery at 550 °C and recrystallization above 600 °C, while HPT KD shows continuous grain growth after annealing above 500 °C. Enhanced thermal stability of ECAP KD is from significant fraction (>50%) of low‐angle grain boundaries (GBs) (misorientation angle 2–15°) stabilizing the microstructure due to their low mobility. Small grain sizes, a high fraction (>80%) of high‐angle GBs (misorientation angle >15°) and accordingly a large amount of stored GB energy, serve as the driving force for HPT KD to undergo grain growth instead of recrystallization driven by excess stored strain energy.
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- Award ID(s):
- 2207965
- PAR ID:
- 10519047
- Publisher / Repository:
- Wiley-VCH
- Date Published:
- Journal Name:
- Advanced Engineering Materials
- Volume:
- 25
- Issue:
- 21
- ISSN:
- 1438-1656
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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- Free Publicly Accessible Full Text
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Accepted Manuscript1.0
- Journal Article:
- https://doi.org/10.1002/adem.202300756
