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This content will become publicly available on December 1, 2025
Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module
The variety of new electronic packaging technologies has grown significantly over the last 20 years as a result of market demands for higher device performance at lower costs and in less space. Those demands have pushed for heterogeneous packaging, where computer chips with different stack heights are closely packed, creating nonuniform heat flux and temperature and additional challenges for thermal management. Without implementing an appropriate thermal management strategy for heterogeneous packages, large temperature gradients can be observed within the package, which would increase the thermal stresses on the chip and raise reliability issues. To mimic this real-life scenario of such packaging, an experimental setup was designed and built. The design of the new experimental setup consists of four identical 1.2 cm × 1.2 cm ceramic heaters, each of which is connected to a separate power supply and can reach a heat flux of 140 W/cm2. Accordingly, this mock package is capable of delivering different power levels to mimic different multicore microprocessor conditions. To give the heater the ability to move precisely in the x-, y-, and z-directions, each heater is mounted to an XYZ linear stage. Deionized water (DI) was used as the working fluid, and a pin-fin heat sink was used to run the initial steady-state tests on the experimental rig. The tests showed how different flow rates at a constant fluid temperature and input power affect the temperatures of the heaters and the thermohydraulic performance of the heat sink. In addition, a three-dimensional numerical model has been developed and validated with experimental data in terms of heat sink pressure drop and the temperatures of the heaters.
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- Award ID(s):
- 2209776
- NSF-PAR ID:
- 10529793
- Publisher / Repository:
- ASME
- Date Published:
- Journal Name:
- Journal of Electronic Packaging
- Volume:
- 146
- Issue:
- 4
- ISSN:
- 1043-7398
- Subject(s) / Keyword(s):
- multichip module liquid cooling heat sink data centers heat transfer Computer simulation Cooling Flow (Dynamics) Heat Heat sinks Multi-chip modules Pressure drop Temperature Fluids Coolants
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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