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1. How to print high-mobility metal oxide transistors—Recent advances in ink design, processing, and device engineering

   https://doi.org/10.1063/5.0125055  

   Scheideler, William J.; Subramanian, Vivek (November 2022, Applied Physics Letters)

   High-throughput printing-based fabrication has emerged as a key enabler of flexible electronics given its unique capability for low-cost integration of circuits based on printed thin film transistors (TFTs). Research in printing inorganic metal oxides has revealed the potential for fabricating oxide TFTs with an unmatched combination of high electron mobility and optical transparency. Here, we highlight recent developments in ink chemistry, printing physics, and material design for high-mobility metal oxide transistors. We consider ongoing challenges for this field that include lowering process temperatures, achieving high speed and high resolution printing, and balancing device performance with the need for high mechanical flexibility. Finally, we provide a roadmap for overcoming these challenges with emerging synthetic strategies for fabricating 2D oxides and complementary TFT circuits for flexible electronics. 

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2. Sub-nm kinetically controlled liquid metal printing of ternary antimony indium oxide transistors

   https://doi.org/10.1016/j.matt.2025.102003  

   Ong, Samuel W; Agnew, Simon A; Rahman, Md Saifur; Scheideler, William J (April 2025, Matter)

   Two-dimensional (2D) metal oxide semiconductors offer a superlative combination of high electron mobility and visible-range transparency uniquely suitable for flexible transparent electronics. Synthesis of these ultrathin (<3 nm) semiconductors by Cabrera-Mott oxidation of liquid metals could enable emerging device applications but requires the precise design of their electrostatics at the nanoscale. This study demonstrates sub-nanometer-level control over the thickness of semiconducting 2D antimony-doped indium oxide (AIO) by manipulating the kinetics of Cabrera-Mott oxidation through variable-speed liquid metal printing at plastic-compatible temperatures (175°C). By modulating both the growth kinetics and doping, we engineer the conductivity and crystallinity of AIO for integration in ultrathin channel transistors exhibiting exceptional steep turn-on, on-off ratios > 106 and an outstanding average mobility of 34.7 ± 12.9 cm2/Vs. This result shows the potential for kinetically controlling 2D oxide synthesis for various high-performance optoelectronic device applications. 

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3. Advances in Liquid Metal Printed 2D Oxide Electronics

   https://doi.org/10.1002/adfm.202403619  

   Scheideler, William J; Nomura, Kenji (June 2024, Advanced Functional Materials)

   Abstract 2D metal oxides (2DMOs) have recently emerged as a high‐performance class of ultrathin, wide bandgap materials offering exceptional electrical and optical properties for a wide area of device applications in energy, sensing, and display technologies. Liquid metal printing represents a thermodynamically advantageous strategy for synthesizing 2DMOs by a solvent‐free and vacuum‐free scalable method. Here, recent progress in the field of liquid metal printed 2D oxides is reviewed, considering how the physics of Cabrera‐Mott oxidation gives this rapid, low‐temperature process advantages over alternatives such as sol‐gel and nanoparticle processing. The growth, composition, and crystallinity of a burgeoning set of 1–3 nm thick liquid metal printed semiconducting, conducting, and dielectric oxides are analyzed that are uniquely suited for the fabrication of high‐performance flexible electronics. The advantages and limitations of these strategies are considered, highlighting opportunities to amplify the impact of 2DMO through large‐area printing, the design of doped metal alloys, stacking of 2DMO to electrostatically engineer new oxide heterostructures, and implementation of 2D oxide devices for gas sensing, photodetection, and neuromorphic computing. 

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4. High-density polarization-induced 2D electron gases in N-polar pseudomorphic undoped GaN/Al0.85Ga0.15N heterostructures on single-crystal AlN substrates

   https://doi.org/10.1063/5.0107159  

   Zhang, Zexuan; Encomendero, Jimy; Kim, Eungkyun; Singhal, Jashan; Cho, YongJin; Nomoto, Kazuki; Toita, Masato; Xing, Huili Grace; Jena, Debdeep (August 2022, Applied Physics Letters)

   The polarization difference and band offset between Al(Ga)N and GaN induce two-dimensional (2D) free carriers in Al(Ga)N/GaN heterojunctions without any chemical doping. A high-density 2D electron gas (2DEG), analogous to the recently discovered 2D hole gas in a metal-polar structure, is predicted in a N-polar pseudomorphic GaN/Al(Ga)N heterostructure on unstrained AlN. We report the observation of such 2DEGs in N-polar undoped pseudomorphic GaN/AlGaN heterostructures on single-crystal AlN substrates by molecular beam epitaxy. With a high electron density of ∼4.3 ×1013/cm2 that maintains down to cryogenic temperatures and a room temperature electron mobility of ∼450 cm2/V s, a sheet resistance as low as ∼320 Ω/◻ is achieved in a structure with an 8 nm GaN layer. These results indicate significant potential of AlN platform for future high-power RF electronics based on N-polar III-nitride high electron mobility transistors. 

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5. The effect of intrinsic layer on the performance of oxide-based p-i-n heterojunctions integrating p-SnOx and n-InGaZnO

   Lee, Dong Hun; Lee, Sunghwan (May 2022, Materials Research Society)

   The discovery of oxide electronics is of increasing importance today as one of the most promising new technologies and manufacturing processes for a variety of electronic and optoelectronic applications such as next-generation displays, batteries, solar cells, and photodetectors. The high potential use seen in oxide electronics is due primarily to their high carrier mobilities and their ability to be fabricated at low temperatures. However, since the majority of oxide semiconductors are n-type oxides, current applications are limited to unipolar devices, eventually developing oxide-based bipolar devices such as p-n diodes and complementary metal-oxide semiconductors. We have contributed to wide range of oxide semiconductors and their electronics and optoelectronic device applications. Particularly, we have demonstrated n-type oxide-based thin film transistors (TFT), integrating In2O3-based n-type oxide semiconductors from binary cation materials to ternary cation species including InZnO, InGaZnO (IGZO), and InAlZnO. We have suggested channel/metallization contact strategies to achieve stable TFT performance, identified vacancy-based native defect doping mechanisms, suggested interfacial buffer layers to promote charge injection capability, and established the role of third cation species on the carrier generation and carrier transport. More recently, we have reported facile manufacturing of p-type SnOx through reactive magnetron sputtering from a Sn metal target. The fabricated p-SnOx was found to be devoid of metallic phase of Sn from x-ray photoelectron spectroscopy and demonstrated stable performance in a fully oxide based p-n heterojunction together with n-InGaZnO. The oxide-based p-n junctions exhibited a high rectification ratio greater than 103 at ±3 V, a low saturation current of ~2x10-10, and a small turn-on voltage of -0.5 V. With all the previous achievements and investigations about p-type oxide semiconductors, challenges remain for implementing p-type oxide realization. For the implementation of oxide-based p-n heterojunctions, the performance needs to be further enhanced. The current on/off ration may be limited, in our device structure, due to either high reverse saturation current (or current density) or non-ideal performance. In this study, two rational strategies are suggested to introduce an “intrinsic” layer, which is expected to reduce the reverse saturation current between p-SnOx and n-IGZO and hence increase the on/off ratio. The carrier density of n-IGZO is engineered in-situ during the sputtering process, by which compositionally homogeneous IGZO with significantly reduced carrier density is formed at the interface. Then, higher carrier density IGZO is formed continuously on the lower carrier density IGZO during the sputtering process without any exposure of the sample to the air. Alternatively, heterogeneous oxides of MgO and SiO2 are integrated into between p-SnOx and n-IGZO, by which the defects on the surface can be passivated. The interfacial properties are thoroughly investigated using transmission electron microscopy and atomic force microscopy. The I-V characteristics are compared between the set of devices integrated with two types of “intrinsic” layers. The current research results are expected to contribute to the development of p-type oxides and their industrial application manufacturing process that meets current processing requirements, such as mass production in p-type oxide semiconductors. 

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