Title: Evaluation of Thermal Stress on IoT-based Federated Learning
Award ID(s):
2300955
PAR ID:
10535920
Author(s) / Creator(s):
; ; ;
Publisher / Repository:
ACM
Date Published:
ISBN:
9798400702372
Page Range / eLocation ID:
291 to 296
Format(s):
Medium: X
Location:
Marietta GA USA
Sponsoring Org:
National Science Foundation
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