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Title: Thermal map dataset for commercial multi/many core CPU/GPU/TPU
Award ID(s):
2113928
PAR ID:
10542848
Author(s) / Creator(s):
;
Publisher / Repository:
Proc. Of 6th ACM/IEEE International Symposium on Machine Learning for CAD (MLCAD'24)
Date Published:
Format(s):
Medium: X
Location:
Snowbird, Utah, USA
Sponsoring Org:
National Science Foundation
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