Huang, Jiyuan, Ambade, Rohan B, Lombardo, Jacob, Brooks, Ben, Poosapati, Aswani, Banerjee, Priyanshu, Saeidi-Javash, Mortaza, Zhang, Yanliang, and Madan, Deepa. Energy density enhancement of scalable thermoelectric devices using a low thermal budget method with film thickness variation. Retrieved from https://par.nsf.gov/biblio/10558116. Applied Materials Today 37.C Web. doi:10.1016/j.apmt.2024.102116.

Huang, Jiyuan, Ambade, Rohan B, Lombardo, Jacob, Brooks, Ben, Poosapati, Aswani, Banerjee, Priyanshu, Saeidi-Javash, Mortaza, Zhang, Yanliang, & Madan, Deepa. Energy density enhancement of scalable thermoelectric devices using a low thermal budget method with film thickness variation. Applied Materials Today, 37 (C). Retrieved from https://par.nsf.gov/biblio/10558116. https://doi.org/10.1016/j.apmt.2024.102116

Huang, Jiyuan, Ambade, Rohan B, Lombardo, Jacob, Brooks, Ben, Poosapati, Aswani, Banerjee, Priyanshu, Saeidi-Javash, Mortaza, Zhang, Yanliang, and Madan, Deepa. "Energy density enhancement of scalable thermoelectric devices using a low thermal budget method with film thickness variation". Applied Materials Today 37 (C). Country unknown/Code not available: Applied Materials Today. https://doi.org/10.1016/j.apmt.2024.102116. https://par.nsf.gov/biblio/10558116.

@article{osti_10558116,
place = {Country unknown/Code not available}, title = {Energy density enhancement of scalable thermoelectric devices using a low thermal budget method with film thickness variation}, url = {https://par.nsf.gov/biblio/10558116}, DOI = {10.1016/j.apmt.2024.102116}, abstractNote = {}, journal = {Applied Materials Today}, volume = {37}, number = {C}, publisher = {Applied Materials Today}, author = {Huang, Jiyuan and Ambade, Rohan B and Lombardo, Jacob and Brooks, Ben and Poosapati, Aswani and Banerjee, Priyanshu and Saeidi-Javash, Mortaza and Zhang, Yanliang and Madan, Deepa}, }