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This content will become publicly available on November 4, 2025

Title: Thermal and Bonding Strength Evaluation of Die Attach Materials for Power Module Packaging
Award ID(s):
2327474
PAR ID:
10563659
Author(s) / Creator(s):
; ; ;
Publisher / Repository:
2024 IEEE 11th Workshop on Wide Bandgap Power Devices & Applications (WiPDA)
Date Published:
ISSN:
2687-8577
ISBN:
979-8-3503-7560-2
Format(s):
Medium: X
Location:
Dayton, OH, USA
Sponsoring Org:
National Science Foundation
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