Ding, Yifan, Zhang, Jianmin, Xue, Ming-Feng, Hua, Xin, Leung, Benjamin, MacIntosh, Eric A, and Hwang, Chulsoon. Equivalent Force Extraction Methodology for Electrical Component Induced PCB Vibration. Retrieved from https://par.nsf.gov/biblio/10565616. IEEE Transactions on Electromagnetic Compatibility 66.1 Web. doi:10.1109/TEMC.2023.3319272.

Ding, Yifan, Zhang, Jianmin, Xue, Ming-Feng, Hua, Xin, Leung, Benjamin, MacIntosh, Eric A, & Hwang, Chulsoon. Equivalent Force Extraction Methodology for Electrical Component Induced PCB Vibration. IEEE Transactions on Electromagnetic Compatibility, 66 (1). Retrieved from https://par.nsf.gov/biblio/10565616. https://doi.org/10.1109/TEMC.2023.3319272

Ding, Yifan, Zhang, Jianmin, Xue, Ming-Feng, Hua, Xin, Leung, Benjamin, MacIntosh, Eric A, and Hwang, Chulsoon. "Equivalent Force Extraction Methodology for Electrical Component Induced PCB Vibration". IEEE Transactions on Electromagnetic Compatibility 66 (1). Country unknown/Code not available: IEEE. https://doi.org/10.1109/TEMC.2023.3319272. https://par.nsf.gov/biblio/10565616.

@article{osti_10565616,
place = {Country unknown/Code not available}, title = {Equivalent Force Extraction Methodology for Electrical Component Induced PCB Vibration}, url = {https://par.nsf.gov/biblio/10565616}, DOI = {10.1109/TEMC.2023.3319272}, abstractNote = {}, journal = {IEEE Transactions on Electromagnetic Compatibility}, volume = {66}, number = {1}, publisher = {IEEE}, author = {Ding, Yifan and Zhang, Jianmin and Xue, Ming-Feng and Hua, Xin and Leung, Benjamin and MacIntosh, Eric A and Hwang, Chulsoon}, }