Tuning Thermal Boundary Conductance of 2D-Substrate Interfaces by Electrostatic Forces
- Award ID(s):
- 2302879
- PAR ID:
- 10587784
- Publisher / Repository:
- IEEE
- Date Published:
- ISBN:
- 979-8-3315-4143-9
- Page Range / eLocation ID:
- 70 to 73
- Format(s):
- Medium: X
- Location:
- Salt Lake City, UT, USA
- Sponsoring Org:
- National Science Foundation
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