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This content will become publicly available on September 3, 2026

Title: Understanding the Origins of Residual Stress in Thin Films Through Measurements and Modeling
Award ID(s):
2006422
PAR ID:
10611467
Author(s) / Creator(s):
;
Publisher / Repository:
The Minerals Metals and Materials Society
Date Published:
Journal Name:
JOM
ISSN:
1047-4838
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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