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35.4: A Miniature Biomedical Implant Secured by Two-Factor Authentication with Emergency Access
- Award ID(s):
- 2146476
- PAR ID:
- 10612062
- Publisher / Repository:
- IEEE
- Date Published:
- Journal Name:
- 2025 IEEE International Solid-State Circuits Conference (ISSCC)
- ISSN:
- 2376-8606
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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