Rothe, Susann, Lienig, Jens, and Sapatnekar, Sachin S. Temperature-aware stress-based migration modeling in IC design: Moving from theory to practice. Retrieved from https://par.nsf.gov/biblio/10617907. AEU - International Journal of Electronics and Communications 200.C Web. doi:10.1016/j.aeue.2025.155909.

Rothe, Susann, Lienig, Jens, & Sapatnekar, Sachin S. Temperature-aware stress-based migration modeling in IC design: Moving from theory to practice. AEU - International Journal of Electronics and Communications, 200 (C). Retrieved from https://par.nsf.gov/biblio/10617907. https://doi.org/10.1016/j.aeue.2025.155909

Rothe, Susann, Lienig, Jens, and Sapatnekar, Sachin S. "Temperature-aware stress-based migration modeling in IC design: Moving from theory to practice". AEU - International Journal of Electronics and Communications 200 (C). Country unknown/Code not available: Elsevier. https://doi.org/10.1016/j.aeue.2025.155909. https://par.nsf.gov/biblio/10617907.

@article{osti_10617907,
place = {Country unknown/Code not available}, title = {Temperature-aware stress-based migration modeling in IC design: Moving from theory to practice}, url = {https://par.nsf.gov/biblio/10617907}, DOI = {10.1016/j.aeue.2025.155909}, abstractNote = {}, journal = {AEU - International Journal of Electronics and Communications}, volume = {200}, number = {C}, publisher = {Elsevier}, author = {Rothe, Susann and Lienig, Jens and Sapatnekar, Sachin S}, }