Liquid Metal Embedded Elastomers (LMEE) as Low-BLT Thermal Interface Materials
- Award ID(s):
- 2233069
- PAR ID:
- 10620423
- Publisher / Repository:
- 2024 40th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
- Date Published:
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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