Development of Backstress Under Different Strain Paths in an Aluminum Alloy: Stress Dip Testing and Modeling
- PAR ID:
- 10627301
- Publisher / Repository:
- Springer
- Date Published:
- Journal Name:
- Metallurgical and Materials Transactions A
- Volume:
- 56
- Issue:
- 1
- ISSN:
- 1073-5623
- Page Range / eLocation ID:
- 28 to 40
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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