Yang, Zhiwei, Ma, Jie, Du, Ning, and Wang, Hong. A bond-based linear peridynamic model for viscoelastic materials and its efficient collocation method. Retrieved from https://par.nsf.gov/biblio/10629316. Computers & Mathematics with Applications 183.C Web. doi:10.1016/j.camwa.2025.01.024.

Yang, Zhiwei, Ma, Jie, Du, Ning, & Wang, Hong. A bond-based linear peridynamic model for viscoelastic materials and its efficient collocation method. Computers & Mathematics with Applications, 183 (C). Retrieved from https://par.nsf.gov/biblio/10629316. https://doi.org/10.1016/j.camwa.2025.01.024

Yang, Zhiwei, Ma, Jie, Du, Ning, and Wang, Hong. "A bond-based linear peridynamic model for viscoelastic materials and its efficient collocation method". Computers & Mathematics with Applications 183 (C). Country unknown/Code not available: Elsevier. https://doi.org/10.1016/j.camwa.2025.01.024. https://par.nsf.gov/biblio/10629316.

@article{osti_10629316,
place = {Country unknown/Code not available}, title = {A bond-based linear peridynamic model for viscoelastic materials and its efficient collocation method}, url = {https://par.nsf.gov/biblio/10629316}, DOI = {10.1016/j.camwa.2025.01.024}, abstractNote = {}, journal = {Computers & Mathematics with Applications}, volume = {183}, number = {C}, publisher = {Elsevier}, author = {Yang, Zhiwei and Ma, Jie and Du, Ning and Wang, Hong}, }