This content will become publicly available on August 22, 2026
                            
                            Cracking in polymer substrates for flexible electronic devices and its mitigation
                        
                    - Award ID(s):
- 2315077
- PAR ID:
- 10629880
- Publisher / Repository:
- Springer Nature
- Date Published:
- Journal Name:
- npj Flexible Electronics
- Volume:
- 9
- Issue:
- 1
- ISSN:
- 2397-4621
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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