Shoemaker, Daniel C, Woo, Kelly, Song, Yiwen, Malakoutian, Mohamadali, Zivasatienraj, Bill, Srivastava, Puneet, Wildeson, Isaac, Chowdhury, Srabanti, and Choi, Sukwon. Enhanced Cooling of Multifinger GaN HEMTs via Topside Diamond Integration. Retrieved from https://par.nsf.gov/biblio/10632537. IEEE Electron Device Letters 46.9 Web. doi:10.1109/LED.2025.3588202.

Shoemaker, Daniel C, Woo, Kelly, Song, Yiwen, Malakoutian, Mohamadali, Zivasatienraj, Bill, Srivastava, Puneet, Wildeson, Isaac, Chowdhury, Srabanti, & Choi, Sukwon. Enhanced Cooling of Multifinger GaN HEMTs via Topside Diamond Integration. IEEE Electron Device Letters, 46 (9). Retrieved from https://par.nsf.gov/biblio/10632537. https://doi.org/10.1109/LED.2025.3588202

Shoemaker, Daniel C, Woo, Kelly, Song, Yiwen, Malakoutian, Mohamadali, Zivasatienraj, Bill, Srivastava, Puneet, Wildeson, Isaac, Chowdhury, Srabanti, and Choi, Sukwon. "Enhanced Cooling of Multifinger GaN HEMTs via Topside Diamond Integration". IEEE Electron Device Letters 46 (9). Country unknown/Code not available: IEEE. https://doi.org/10.1109/LED.2025.3588202. https://par.nsf.gov/biblio/10632537.

@article{osti_10632537,
place = {Country unknown/Code not available}, title = {Enhanced Cooling of Multifinger GaN HEMTs via Topside Diamond Integration}, url = {https://par.nsf.gov/biblio/10632537}, DOI = {10.1109/LED.2025.3588202}, abstractNote = {}, journal = {IEEE Electron Device Letters}, volume = {46}, number = {9}, publisher = {IEEE}, author = {Shoemaker, Daniel C and Woo, Kelly and Song, Yiwen and Malakoutian, Mohamadali and Zivasatienraj, Bill and Srivastava, Puneet and Wildeson, Isaac and Chowdhury, Srabanti and Choi, Sukwon}, }