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PISOV: Physics-Informed Separation of Variables Solvers for Full-Chip Thermal Analysis
- Award ID(s):
- 2305437
- PAR ID:
- 10637848
- Publisher / Repository:
- IEEE
- Date Published:
- Journal Name:
- IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
- Volume:
- 44
- Issue:
- 5
- ISSN:
- 0278-0070
- Page Range / eLocation ID:
- 1874 to 1886
- Format(s):
- Medium: X
- Sponsoring Org:
- National Science Foundation
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