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Title: PISOV: Physics-Informed Separation of Variables Solvers for Full-Chip Thermal Analysis
Award ID(s):
2305437 2113928
PAR ID:
10637848
Author(s) / Creator(s):
; ; ; ; ;
Publisher / Repository:
IEEE
Date Published:
Journal Name:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Volume:
44
Issue:
5
ISSN:
0278-0070
Page Range / eLocation ID:
1874 to 1886
Format(s):
Medium: X
Sponsoring Org:
National Science Foundation
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